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On the same subject

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  November 7, 2018 | International, C4ISR

  Bringing Photonic Signaling to Digital Microelectronics

  DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01

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  October 18, 2021 | International, Land

  Here are companies are competing to replace the Bradley

  Five companies are competing to win the optionally-manned fighting vehicle contract. Defense News Weekly's Jen Judson rounds up the contenders.

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  June 20, 2019 | International, Aerospace

  Pentagon, Lockheed Martin Failed to Ensure Proper Parts for F-35

  CHARLES S. CLARK A major contractor and the Pentagon's top management office came in for criticism from an inspector general for cutting corners in assuring that the massive joint-service F-35 stealth fighter is equipped with ready-for-issue parts. In a report dated June 13, the Defense Department watchdog found that parts for the department's largest acquisition—with an estimated $406 billion price tag and sales planned to foreign allies—were not being received according to the contracts and performance incentives. The parts contracted for delivery by Lockheed Martin Corp. include wheel, seat, and window assemblies, said the audit addressed to the Defense secretary for acquisition, the Air Force secretary, the Air Force inspector general and the Defense Contract Management Agency. The federal contracting offices and the corporate teams working on the plane are supposed to ensure the sustaining parts are delivered “ready for aircraft maintenance personnel to install on the aircraft,” as well as have an Electronic Equipment Logbook assigned that spells out each part's history and remaining life. Too often, however, the parts arrived not ready in accordance with contracts and incentive fees on the sustainment contracts because of “inflated and unverified F‑35A aircraft availability hours. This occurred because the [Joint Program Office] did not conduct adequate oversight of contractor performance related to receiving F‑35 spare parts and aircraft availability hours,” the report said, calling the inflation of hours unintentional. As a result, the department received non-ready spare parts and spent up to $303 million in labor costs since 2015, “and it will continue to pay up to $55 million annually” for such parts until a fix is made. In addition, the Defense Department has “potentially overpaid” $10.6 million in performance incentive fees by not independently collecting and verifying aircraft availability hours. “The lack of available [ready-for-issue] spare parts could result in the F‑35 fleet being unable to perform required operational and training missions,” the report warned. The Joint Program Office was aware of the problem, auditors found during their review from June 2018 to April 2019, but did not resolve the issue or require the services to better track the non-compliant parts. Interviews with the Joint Program Office staff in Arlington, Va.; the DCMA administrative office in Lockheed Martin's facility in Fort Worth, Texas; and Lockheed staff at three sites found, for example, that of 74 spare parts delivered to Hill Air Force Base in Utah from Sept. 17-30, 2018, 59 spare parts (80 percent) were non-ready for issue. Of the 263 spare parts delivered to Luke Air Force Base in Arizona in June 2018, 213 spare parts (81 percent) were non‑ready. And of 132 spare parts delivered to the Marine Corps Air Station in Beaufort, S.C., in September 2017, 58 spare parts (44 percent) were non‑ready. The IG recommended that the F-35 program executive officer improve oversight by coordinating with DCMA to pursue compensation from the contractor for the costs of mishandling the supply of spare parts since 2015. It also recommended that he direct the contracting officer to add clarifying language to future sustainment contracts, and task the lead contracting office with updating its Quality Assurance Surveillance Plan. Navy Vice Adm. Mathias Winter, the program executive, agreed, stating that there is value added in tracking and using contractor performance data. https://www.govexec.com/defense/2019/06/pentagon-lockheed-martin-failed-ensure-proper-parts-f-35/157822/