6 mai 2024 | International, Aérospatial

Sweden goes back to the drawing board for a next-gen warplane

In the global push to reimagine air power, Stockholm is taking a breather to figure out its path.

https://www.defensenews.com/global/europe/2024/05/06/sweden-goes-back-to-the-drawing-board-for-a-next-gen-warplane/

Sur le même sujet

  • Intevac Receives Record $40 M Digital Night Vision Contract Award

    22 juillet 2019 | International, Aérospatial, Terrestre, C4ISR

    Intevac Receives Record $40 M Digital Night Vision Contract Award

    Intevac, Inc. (Nasdaq: IVAC) announced today it has received a $40 million contract award for the multi-year production of digital night vision cameras in support of the U.S. Government. “With this new order and increased backlog, we now have multi-year visibility for our manufacturing operations, and continued validation of our digital night vision technology.” “This award represents the largest single booking to date for Intevac Photonics, and increases our Photonics backlog to the historic level of just over $83 million,” commented Timothy Justyn, executive vice president and general manager of Intevac Photonics. “This award closely follows awards for both the U.S. Army's IVAS ground soldier program, and the Apache Helicopter's Pilot Night Vision Sensor (PNVS) foreign military sales announced last December, demonstrating Intevac's commitment to delivering the latest digital night vision technology to our Warfighters.” “We are very proud to have received this substantial order for our digital night vision technology,” added Wendell Blonigan, president and chief executive officer of Intevac. “With this new order and increased backlog, we now have multi-year visibility for our manufacturing operations, and continued validation of our digital night vision technology.” Intevac's digital night-vision sensors, based on its patented Electron Bombarded Active Pixel Sensor (EBAPS®) technology, provide state-of-the-art capability to the most advanced avionic fighting platforms in the U.S. Department of Defense inventory. Intevac was founded in 1991 and has two businesses: Thin-film Equipment and Photonics. In our Thin-film Equipment business, we are a leader in the design and development of high-productivity, thin-film processing systems. Our production-proven platforms are designed for high-volume manufacturing of substrates with precise thin film properties, such as the hard drive media, display cover panel, and solar photovoltaic markets we serve currently. In our Photonics business, we are a recognized leading developer of advanced high-sensitivity digital sensors, cameras and systems that primarily serve the defense industry. We are the provider of integrated digital imaging systems for most U.S. military night vision programs. For more information call 408-986-9888, or visit the Company's website at www.intevac.com . This press release includes statements that constitute “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Reform Act”). Intevac claims the protection of the safe-harbor for forward-looking statements contained in the Reform Act. These forward-looking statements are often characterized by the terms “may,” “believes,” “projects,” “expects,” or “anticipates,” and do not reflect historical facts. Specific forward-looking statements contained in this press release include, but are not limited to; the multi-year visibility of camera deliveries. The forward-looking statements contained herein involve risks and uncertainties that could cause actual results to differ materially from the company's expectations. These risks include, but are not limited to: changes in planned shipment dates, which could have a material impact on our business, our financial results, and the company's stock price. These risks and other factors are detailed in the Company's periodic filings with the U.S. Securities and Exchange Commission. Source: Intevac, Inc.http://www.asdnews.com/news/defense/2019/07/18/intevac-receives-record-40-m-digital-night-vision-contract-award

  • BAE Maturing microelectronics for next-generation radar, electronic warfare, and communications systems

    18 septembre 2018 | International, C4ISR

    BAE Maturing microelectronics for next-generation radar, electronic warfare, and communications systems

    BAE Systems has signed a cooperative agreement with the Air Force Research Laboratory (AFRL) for Phase 1 of a technical effort to transition gallium nitride (GaN) semiconductor technology developed by the U.S. Air Force to our Advanced Microwave Products (AMP) Center. We've signed a cooperative agreement with the Air Force Research Laboratory (AFRL) for Phase 1 of a technical effort to transition gallium nitride (GaN) semiconductor technology developed by the U.S. Air Force to our Advanced Microwave Products (AMP) Center. As part of the effort, we'll transfer and further enhance the technology, and scale it to 6-inch wafers to slash per-chip costs and improve the accessibility of this defense-critical technology. GaN technology provides broad frequency bandwidth, high efficiency, and high transmit power in a small footprint, making it ideal for next-generation radar, electronic warfare, and communications systems. Under the agreement, we will work with AFRL to establish a 140-nanometer GaN monolithic microwave integrated circuit (MMIC) process that will be qualified for production by 2020, with products available to Department of Defense (DoD) suppliers through an open foundry service. “Millimeter-wave GaN technologies today are produced in research and development laboratories in low volumes at high associated costs or in captive foundries that are not broadly accessible to defense suppliers,” said Scott Sweetland, Advanced Microwave Products director at BAE Systems. “This effort will leverage AFRL's high-performance technology and BAE Systems' 6-inch manufacturing capability to advance the state of the art in GaN MMIC performance, reliability, and affordability while providing broader access to this critical technology.” The work on this project will primarily take place in our 70,000-square-foot Microelectronics Center (MEC) in Nashua, New Hampshire, where we research, develop, and produce compound semiconductor materials, devices, circuits, and modules for a wide range of microwave and millimeter-wave applications. The MEC has been an accredited DoD Category 1A Trusted Supplier since 2008, and fabricates integrated circuits in production quantities for critical DoD programs. As part of the project, the AMP Center team will work closely with the company's FAST LabsTM research organization and MMIC design experts from ENGIN-IC. https://www.baesystems.com/en/article/maturing-microelectronics-for-next-generation-radar-electronic-warfare-and-communications-systems

  • Lockheed’s new F-16 training center in Romania could train Ukrainians

    17 septembre 2023 | International, Aérospatial, Sécurité

    Lockheed’s new F-16 training center in Romania could train Ukrainians

    Romanian pilots will be the first to learn to fly F-16s at this in-the-works training center — but Ukraine and other nations could follow.

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