6 février 2024 | International, Terrestre

Nato orders AT4 anti-armour weapons from Saab

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  • Bringing Photonic Signaling to Digital Microelectronics

    7 novembre 2018 | International, C4ISR

    Bringing Photonic Signaling to Digital Microelectronics

    DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01

  • Germany And Lockheed Martin ‘Sprint’ For F-35 Contract Finalization

    23 juin 2022 | International, Aérospatial

    Germany And Lockheed Martin ‘Sprint’ For F-35 Contract Finalization

    Germany is pursuing an accelerated timeline for its Lockheed Martin F-35 Joint Strike Fighter acquisition as the country looks to bring the aircraft into operation before the end of the decade.

  • Airbus A330 delivery brings dedicated tanker capability to South Korean Air Force

    14 novembre 2018 | International, Aérospatial

    Airbus A330 delivery brings dedicated tanker capability to South Korean Air Force

    By: Mike Yeo MELBOURNE, Australia ― The first Airbus A330 Multi Role Tanker Transport for the Republic of Korea Air Force has landed in South Korea for its acceptance tests. According to a news release from the manufacturer, the aircraft, which was piloted by a joint Airbus and Air Force crew, arrived at Gimhae Air Base in Busan after a ferry flight from the Airbus Final Assembly Line in Getafe, Spain, with a stop in Vancouver, Canada. It will now undergo ground and flight tests in Gimhae. The Air Force will be supported by a team from Airbus, which will be based in South Korea for the duration of the tests and until the aircraft is officially handed over to the customer. Airbus did not specify how long the acceptance tests will last, and referred questions about the specifics of the test program to the Air Force. This aircraft is the first of four ordered by South Korea. Its arrival marks the second regional customer of the A330 MRTT to receive its first aircraft this year, with the first of Singapore's six aircraft having been delivered in August. Another customer, France, had also taken delivery of its first MRTT in October. The A330 MRTT marks the introduction of a dedicated tanker capability for South Korea's Air Force, and it will allow the service's fighters to increase their persistence during missions. The service is currently operating the Boeing F-15K Slam Eagle and the Lockheed Martin KF-16C/D Fighting Falcon as its primary combat aircraft. South Korea has also ordered the Lockheed Martin F-35A Lightning II Joint Strike Fighter, with the first one for the Air Force rolling out earlier this year. South Korea selected the A330 MRTT for its $1.26 billion KC-X program in 2015 after evaluating competing proposals from Boeing, with the KC-46 Pegasus, and Israel Aerospace Industries, who proposed converting 767 airliners in a tanker aircraft. https://www.defensenews.com/air/2018/11/13/airbus-a330-delivery-brings-dedicated-tanker-capability-to-south-korean-air-force

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