Italy's Leonardo and Franco-German KNDS to create tank alliance

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  24 juillet 2019 | International, Terrestre

  Collins Aerospace gets sixth order from U.S. Army for production of next-generation Manpack radios

  CEDAR RAPIDS, Iowa (July 23, 2019) – Collins Aerospace Systems, a unit of United Technologies Corp. (NYSE: UTX), has received its sixth order from the U.S. Army to provide PRC-162 software-defined ground radios for the Handheld, Manpack and Small Form Factor (HMS) program. This sixth order was issued under a multiple award contract that the Army awarded to Rockwell Collins and two other companies in 2016. The contract, which has a $12.7 billion maximum firm-fixed-price with an estimated completion date of March 2026, moves the Army another step closer toward modernizing communications on the battlefield. The PRC-162 is a two-channel ground radio, both man-portable and vehicle-mountable, that will enable the Army to tap into next-generation communications capabilities such as the Department of Defense's new Mobile User Objective System (MUOS) while maintaining interoperability with legacy waveforms. An open-architecture design also allows for software-upgradeable capabilities in the future. “Success in today's multi-domain battlespace depends heavily on secure and reliable communications,” said Phil Jasper, president, Mission Systems for Collins Aerospace. “We've applied decades of proven experience in airborne communications to provide the Army with a next-generation ground radio that will give troops a heightened level of situational awareness and a tactical advantage.” The PRC-162 is a part of Collins Aerospace's TruNet™ networked communications family of products, which includes ground and airborne radios, advanced networking waveforms, applications, and support and services that enable ground and airborne elements to exchange critical data, images, voice and video in real time. About Collins Aerospace Collins Aerospace Systems, a unit of United Technologies Corp. (NYSE: UTX), is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Created in 2018 by bringing together UTC Aerospace Systems and Rockwell Collins, Collins Aerospace has the capabilities, comprehensive portfolio and expertise to solve customers' toughest challenges and to meet the demands of a rapidly evolving global market. For more information, visit CollinsAerospace.com. About United Technologies Corporation United Technologies Corp., based in Farmington, Connecticut, provides high-technology systems and services to the building and aerospace industries. By combining a passion for science with precision engineering, the company is creating smart, sustainable solutions the world needs. For more information about the company, visit our website at www.utc.com or follow us on Twitter: @UTC. https://www.epicos.com/article/449255/collins-aerospace-gets-sixth-order-us-army-production-next-generation-manpack-radios

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  5 juin 2020 | International, Aérospatial, C4ISR

  CACI Awarded $1.5 Billion Contract to Provide Transport and Cybersecurity Services to National Geospatial-Intelligence Agency

  June 4, 2020 - CACI International Inc (NYSE: CACI) announced today that it has been awarded its largest contract in company history, a single-award Indefinite Delivery Indefinite Quantity (IDIQ) contract to provide transport and cybersecurity services to the National Geospatial-Intelligence Agency (NGA). The single award IDIQ has a base period of five years plus five 1-year award term periods with a ceiling of $1.5 billion. Under the contract, CACI will provide enterprise Information Technology (IT) services to NGA and its mission partners. Specifically, CACI network and cybersecurity experts, located at NGA's headquarters and facilities in Springfield, VA, St. Louis, MO, and around the globe, will help design, engineer, procure, implement, operate, sustain, and enhance NGA networks and cybersecurity posture. The contract encompasses a significant expansion of CACI's continuing business with the NGA. CACI will also help NGA create efficiencies by making available an expansive service and material catalog to the agency that streamlines the acquisition of IT services from weeks to days for streamlined customer support. John Mengucci, CACI President and Chief Executive Officer, said, “This record award demonstrates CACI is delivering on its strategy to win larger, more enduring contracts. It also represents our steadfast commitment to protecting and defending our nation's networks so the NGA can deliver mission-critical geospatial intelligence to the warfighter around the globe.” CACI Executive Chairman and Chairman of the Board Dr. J.P. (Jack) London, said, “CACI is proud to support the NGA's mission of collecting, analyzing, and distributing geospatial intelligence in support of national security. Our work will always reflect CACI's culture of character, ethics, and integrity.” CACI's 23,000 talented employees are vigilant in providing the unique expertise and distinctive technology that address our customers' greatest enterprise and mission challenges. Our culture of good character, innovation, and excellence drives our success and earns us recognition as a Fortune World's Most Admired Company. As a member of the Fortune 1000 Largest Companies, the Russell 1000 Index, and the S&P MidCap 400 Index, we consistently deliver strong shareholder value. Visit us at www.caci.com. There are statements made herein which do not address historical facts, and therefore could be interpreted to be forward-looking statements as that term is defined in the Private Securities Litigation Reform Act of 1995. Such statements are subject to factors that could cause actual results to differ materially from anticipated results. The factors that could cause actual results to differ materially from those anticipated include, but are not limited to, the risk factors set forth in CACI's Annual Report on Form 10-K for the fiscal year ended June 30, 2019, and other such filings that CACI makes with the Securities and Exchange Commission from time to time. Any forward-looking statements should not be unduly relied upon and only speak as of the date hereof. CACI-Contract Award View source version on businesswire.com: https://www.businesswire.com/news/home/20200604005132/en/

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  7 novembre 2018 | International, C4ISR

  Bringing Photonic Signaling to Digital Microelectronics

  DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01