Number of Armed UAVs Set To Expand Significantly | Aviation Week Network

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  November 7, 2018 | International, C4ISR

  Bringing Photonic Signaling to Digital Microelectronics

  DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01

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  September 9, 2021 | International, Aerospace

  Indonesia orders five C-130J aircraft from Lockheed

  Indonesia has quietly signed a contract with Lockheed Martin for C-130J Super Hercules transport aircraft, multiple sources have told Defense News.

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  June 22, 2023 | International, Other Defence

  IDEaS Innovator Update

  Dear Canadian Innovators,   On Monday, 19 June, NATO DIANA launched its first three pilot challenges. Applications are now open to world-class innovators who have exceptional ideas to help solve dual-use critical defence and security problems.   DIANA’s Pilot Challenge call focuses on the following three areas:   Energy Resilience:      In an uncertain and changing world, there is an urgent need for more reliable, resilient, and efficient energy solutions – particularly in the aftermath of natural disasters or in conflict zones. Climate change and its consequences will only make that need greater.   For this challenge, DIANA is therefore seeking technology solutions that enable the modular design of microgrids that can meet supply demands reliably. Of interest are technologies and systems that are capable of scaling and that are interoperable with other similar systems; renewable power generation; power storage; hardware and software for adaptive and intelligent power conditioning and management; and technologies for the detection and protection of the physical system and components from malicious cyber-attack.   Download the Problem Statement here    Secure Information Sharing:     By secure information sharing, we typically mean the ability to exchange documents and other static content with others safely, without the risk of interference by malicious actors. However, while protecting document-based information transfer in an office environment is important, it is a simpler task than securing multiple forms of information flow when working in the field or on the move, as is often the case with first-responders, peacekeeping forces and the military.   For this challenge, DIANA is looking for ways of creating a secure and trusted information environment – with the emphasis on live data streams such as those used to provide near real-time video, augmented reality feeds, digital radio and more. Of particular interest are hardware and software solutions that operate over open networks and that can function in ‘austere’ or ‘disadvantaged’ environments.   Download the Problem Statement here    Sensing and Surveillance:     Coastal waters are vital to the economic and security interests of the countries whose borders they touch, and critical to all who rely on them for commerce, transportation, recreation, and food, for example. Yet, even today, our understanding of the undersea environment is limited – not least because many standard methods of observation don’t work well underwater and because the marine environment is difficult to access and to work in for extended periods.   For this challenge, DIANA is seeking components and systems for sensing and information gathering in subsurface coastal zones. Applications of interest might include, but are not limited to, novel techniques and/or advanced capabilities for seafloor mapping, undersea infrastructure monitoring, manmade object and marine-life tracking, climate-change-effects sensing, and patterns-of-life visualisations.   Download the Problem Statement here The call for proposals will be open until 25 August 2023.  In Phase one of the DIANA accelerator program, approximately 30 innovators will receive grant funding of $150,000 CAD/ € 100,000 EUR starting in late 2023. At the end of Phase One, a smaller number of companies will be offered an additional grant of up to $450,000 CAD/ € 300,000 EUR and be invited to participate in Phase Two of the accelerator programme called ‘Scale’. During this second six months, companies will focus on demonstrating their technological solution, developing transition strategies, and working with investors and end users to identify pathways to adoption. Once DIANA achieves full operating capability in 2025, DIANA will run up to ten challenge programmes per year and have the capacity to interact with hundreds of innovators each year.   The application portal can be accessed via DIANA’s official website.   Through the web link and the DIANA LinkedIn page, you can also find additional information related to the initiative and stay notified on all of DIANA’s publications and updates.   The Department of National Defence is looking forward to seeing our Canadian Innovator Community actively participating in the NATO DIANA program and wishes you luck in this process.    Note – any questions related to DIANA challenges or eligibility should be directed to NATO DIANA via DIANA’s official website, linked here.