Lockheed wins $10.9B contract to modernize F-22

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  19 juillet 2018 | International, Naval

  US Navy asks Congress to shift millions of dollars to fix high-tech supercarrier

  By: David B. Larter WASHINGTON — The U.S. Navy needs to get the permission of lawmakers to move $62.7 million to fix a number of hiccups in its high-tech new carrier, the Gerald R. Ford, during its post-shakedown availability that kicked off July 15. The money, part of a larger DoD reprogramming request from June, will go toward fixing a number of issues that arose during its recently concluded post-delivery trials, according to a copy of the request obtained by Defense News. According to the document, the Navy needs to move: $12.7 million to fix “continuing technical deficiencies” with the Advanced Weapon Elevators. $30 million for “tooling and repair” of the main thrust bearings, issues that the Navy has blamed on the manufacturer. $20 million for additional repairs, a prolonged post-shakedown availabilty, and parts and labor. By: David Larter The Navy told Congress in May that it was going to exceed the Ford's $12.9 billion cost cap because of needed repairs and alterations. The $62.7 million was part of that total repair bill. The repairs and technology setbacks extended the Ford's PSA at Huntington Ingalls' Newport News Shipbuilding from eight months to 12 months, according to a statement from Naval Sea Systems Command, and significantly added to the cost. The ship will then proceed to full-ship shock trials ahead of its first deployment, a priority pushed by Senate Armed Services Committee Chairman Sen. John McCain, R-Ariz., according to the document. Since its delivery, the Ford has spent 81 days at sea during the eight times it was underway, a July 15 NAVSEA release said. “The ship has completed 747 shipboard aircraft launches and recoveries against a plan of approximately 400,” the release said. “CVN 78 successfully completed fixed-wing aircraft/helicopter integration and compatibility testing, air traffic control center certification, JP-5 fuel system certification, daytime underway replenishment capability demonstration, ship's defensive system demonstration, Dual Band Radar testing, and propulsion plant operations.” https://www.defensenews.com/naval/2018/07/18/us-navy-asks-congress-to-shift-millions-to-fix-its-new-high-tech-supercarrier/

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  7 novembre 2018 | International, C4ISR

  Bringing Photonic Signaling to Digital Microelectronics

  DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01

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  27 juillet 2018 | International, C4ISR

  How Army researchers are using software and analytics to maximize battlefield power

  By: Todd South ABERDEEN PROVING GROUND, Md. — As soldiers at every level become more connected and devices proliferate, the strain on the field-level power grid increases. Staff at the Army's Research, Development and Engineering Command dove into the finer details of power management, auto tuning and analytics to drive how soldiers use power in the field. Most of that work is focused around the tactical microgrid, basically the network of power that runs tactical operations. Think thick cables, generators and all the power that lets the computers, radios and networks run to digest the vast amounts of information, communication and other electrical needs consumed by a modern military. In the not-too-distant past, generator operators and technicians played a sophisticated guessing game that involved a clock, multimeter, flashlight and notepad to measure and mark which power supplies were running, at what level, and where they were on fuel. But by adding digital capabilities and software-driven devices into the guts of what were simple analog generators and boxes full of copper wiring and switches, they have created a type of brain for what was formerly a mindless system. That's resulted in the new Advanced Medium Mobile Power Source, the first new generator for the service in years. The combination of that device, controllers within the system, and advanced software gives the soldier a centralized place to monitor and manipulate the different devices in the microgrid that will help the flow of power move to where its needed. “I can tell you if you're using too many lights or computers on one of those three phase lines and if you're out of balance,” said Bradley Stanley, an RDECOM computer scientist. By using software to make those readings, the end user can then shift the strain to other parts of the system, maximizing power output and fuel use for what can be 24-hour, days long operations. Another software improvement in “autotuning” is helping make what can be a multi-person with expert training four-hour job into an automated procedure handled by the computer. https://www.armytimes.com/news/your-army/2018/07/26/how-army-researchers-are-using-software-and-analytics-to-maximize-battlefield-power