18 septembre 2018 | International, C4ISR
BAE Systems has signed a cooperative agreement with the Air Force Research Laboratory (AFRL) for Phase 1 of a technical effort to transition gallium nitride (GaN) semiconductor technology developed by the U.S. Air Force to our Advanced Microwave Products (AMP) Center.
We've signed a cooperative agreement with the Air Force Research Laboratory (AFRL) for Phase 1 of a technical effort to transition gallium nitride (GaN) semiconductor technology developed by the U.S. Air Force to our Advanced Microwave Products (AMP) Center. As part of the effort, we'll transfer and further enhance the technology, and scale it to 6-inch wafers to slash per-chip costs and improve the accessibility of this defense-critical technology.
GaN technology provides broad frequency bandwidth, high efficiency, and high transmit power in a small footprint, making it ideal for next-generation radar, electronic warfare, and communications systems. Under the agreement, we will work with AFRL to establish a 140-nanometer GaN monolithic microwave integrated circuit (MMIC) process that will be qualified for production by 2020, with products available to Department of Defense (DoD) suppliers through an open foundry service.
“Millimeter-wave GaN technologies today are produced in research and development laboratories in low volumes at high associated costs or in captive foundries that are not broadly accessible to defense suppliers,” said Scott Sweetland, Advanced Microwave Products director at BAE Systems. “This effort will leverage AFRL's high-performance technology and BAE Systems' 6-inch manufacturing capability to advance the state of the art in GaN MMIC performance, reliability, and affordability while providing broader access to this critical technology.”
The work on this project will primarily take place in our 70,000-square-foot Microelectronics Center (MEC) in Nashua, New Hampshire, where we research, develop, and produce compound semiconductor materials, devices, circuits, and modules for a wide range of microwave and millimeter-wave applications. The MEC has been an accredited DoD Category 1A Trusted Supplier since 2008, and fabricates integrated circuits in production quantities for critical DoD programs.
As part of the project, the AMP Center team will work closely with the company's FAST LabsTM research organization and MMIC design experts from ENGIN-IC.
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by Linda Shiner In my interviews with F-35 pilots, one word repeatedly came up: “survivability.” Surviving the Lockheed Martin F-35's primary mission—to penetrate sophisticated enemy air defenses and find and disable threats—requires what the fifth-generation jet offers: stealth and a stunning array of passive and active sensors bringing information to the pilot. The F-35 can see trouble coming—ahead, behind, or below the aircraft—far enough in advance to avoid a threat or kill it. Faced with multiple threats, the sensor suite recommends the order in which they should be dispatched. U.S. forces first took these capabilities into combat last September, when Marine F-35Bs struck the Taliban in Afghanistan (five months after its combat debut with the Israeli air force). More than 360 of the multi-service aircraft—Air Force F-35As, Marine short-takeoff-and-vertical-landing Bs, and carrier-capable Cs—have been delivered to 16 U.S. airbases and to seven other countries. Reaching these milestones has not been easy. The program's difficulties and its cost—$406 billion for development and acquisition—have been widely reported. But now the F-35 is in the hands of the best judges of its performance, its pilots. I asked eight of them—test pilots who contributed to the jet's development as well as active-duty pilots—about their experiences. Here, in their own words, are their answers. Full article: https://www.airspacemag.com/military-aviation/f-35-faces-most-critical-test-180971734/