US Air Force fires hypersonic ARRW in first test since March failure

On the same subject

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  September 29, 2020 | International, Aerospace

  Nouvelle commande pour l'Airbus A330 MRTT

  L'Occar transforme en commande ferme une option sur un Airbus A330 MRTT dans le cadre du contrat MMF qui vise à créer une flotte de ravitailleurs pour plusieurs pays européens. Quatre Airbus A330 MRTT en un mois Après la commande passée par la France pour trois Airbus A330 transformables en MRTT dans le cadre du plan de relance du gouvernement, c'est au tour de l'Occar transformer en achat ferme une des trois options prises dans le cadre du contrat MMF (Multinational MRTT Fleet) qui porte sur huit Airbus A330 MRTT fermes. Initié en 2012 par l'Agence européenne de la Défense, ce contrat est géré par l'Occar pour le compte de la NSPA, l'agence de soutien et d'achats de l'OTAN. L'objectif est de mettre le parc à la disposition de plusieurs pays européens : les Pays-Bas, le Luxembourg, la Norvège, l'Allemagne, la Belgique et la République Tchèque. Le Luxembourg veut plus d'heures Les Etats participant au programme MMF ont un accès exclusif aux ravitailleurs qui sont gérés en pool par l'OTAN. Les coûts et le personnel sont répartis en fonction du nombre d'heures de vol requises par chaque pays. C'est la demande du Luxembourg d'augmenter son quota d'heures de vol qui a d'ailleurs déclenché cette commande qui porte désormais à neuf le nombre d'Airbus A330 MRTT commandés fermes auxquels s'ajoutent deux options. Le Luxembourg veut en effet passer de 200 à 1 200 heures de vol. Des avions multimissions Comme les deux premiers exemplaires livrés, l'appareil sera configuré pour réaliser plusieurs missions : le ravitaillement en vol mais aussi le transport de personnels et de fret ainsi que les opérations d'évacuation médicale. La pandémie de coronavirus ou covid-19 a d'ailleurs été l'occasion pour les A330 MRTT Phénix de l'Armée de l'Air de démontrer ses capacités en matière d'évacuation médicale d'urgence dans le cadre de l'Opération Résilience qui a nécessité l'installation de postes de réanimation lourde pour accompagner le transport des patients. https://air-cosmos.com/article/nouvelle-commande-pour-lairbus-a330-mrtt-23664

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  October 29, 2019 | International, Naval

  Submarines are poised to take on a major role in strike warfare, but is that a good idea?

  By: David B. Larter WASHINGTON — The U.S. Navy is preparing to ink one of the largest contracts in its history with General Dynamics Electric Boat and the firm's partner shipyard Huntington Ingalls Industries Newport News that will make the new generation of attack submarines a major force in strike warfare. The Block V Virginia contract is expected to produce 11 boats with eight Virginia Payload Modules, and will triple the Virginia's Tomahawk Land Attack Missile capacity to 40 missiles per hull. Experts say that the new Virginia Payload Module will also be large enough to accommodate boost-glide hypersonic missiles like those the Navy is developing with the Army. But the logic for the Virginia Payload Module has always been about replacing the Ohio-class guided missile submarines retiring in the 2020s. Because submarines have been the Navy's go-to asset to penetrate areas threated by Chinese and Russian surface-to-surface and anti-ship missiles, attack submarines loaded with strike missiles would have to be the ones to get close enough to be able to launch land-attack strikes. That model upends decades of the surface Navy's supremacy in the world of strike warfare from the sea, but experts are beginning to question the logic of giving the strike warfare mission to submariners in an era of great power competition. With Russia and, to an even greater extent, China investing heavily in anti-submarine technology, does it make sense to give a stealthy asset a mission that will blow its cover? Bryan Clark, a retired submariner and senior fellow at the Center for Strategic and Budgetary Assessments, wonders if the surface fleet is the best place inside the force to house the strike mission. “I think the requirement may be changing,” he said in an Oct. 22 phone call with Defense News. “Over the past 10 years there has been a real emphasis on the submarine as the one tool we have that may be able to get into contested areas — the East and South China seas, up in the north Atlantic, etc. “That's changing now: These countries are investing in their own anti-submarine warfare systems. China has put a lot of money into ASW systems, they are installing surveillance systems akin to our SOSUS [sound surveillance system]. So the idea that our submarines are our go-to asset to gain access, that may not be true in the next few years as it was in the past 10, so there is a question as to whether we should be investing in submarines to maintain the undersea strike capacity.” ‘Increasingly vulnerable' The issue is not just that submarines run the risk of being detected, which is an ever-present risk anytime a submarine leaves the pier, but that it won't be able to create the volume of fires that the surface fleet could, especially with new concepts in development such as a large unmanned surface vessel that could act as a kind of arsenal ship. “The surface fleet is likely going to be our best strike capacity asset in the next decade,” Clark said. “Submarines are going to be increasingly vulnerable, so the question becomes: Do I want to take my [Virginia Payload Module]-equipped SSN, put it inside the South China Sea to launch strikes, get counter-detected and harassed for days afterward? I lose it from the fight for a long time just evading attacks. “Whereas if you used unmanned surface vessel[s], those can launch just as many cruise missiles as a Virginia class, many times cheaper; they can rotate, get reloaded and just keep launching strikes at a much higher rate of fire as you would ever get out of the SSN force.” Jerry Hendrix, a retired naval flight officer and analyst with The Telemus Group, agreed that the surface fleet is likely going to be the place to house a strike capability, especially in the era of mass hypersonic fires, because of the cost it would impose on the U.S. to try to match Chinese capabilities on subs. “I think there is a powerful argument to distribute these weapons across the surface force,” Hendrix said. “If you can create a strike weapon that allows the surface force to stand outside of DF-21 and DF-26 range and shoot three-pointers from outside, then yes. To create mass and volume in the submerged force is twice to three times as expensive as it is to create that volume from the surface force. “So there is a solid argument just from the standpoint of cost. If I was trying to create 2,000 tubes of hypersonics — which are much more massive than Tomahawks, wont fit into a Mark 41 vertical launch system and hence will have to go into a different configuration — to create that mass in the submerged force is going to be very expensive.” The Navy is looking at back-fitting destroyers with larger vertical launching system tubes to accommodate so-called prompt-strike weapons, Defense News reported in June. But some analysts say the mission is better suited for a large unmanned surface vessel. “I think this is going to one of the main things driving the design of the large unmanned surface combatant,” said Dan Gouré, an analyst at the Lexington Institute think tank. “We're back to arsenal ship: long-range, park it into a surface action group of carrier strike group — kind of like a surface version of the SSGN.” https://www.defensenews.com/naval/2019/10/28/submarines-are-poised-to-take-on-a-major-role-in-strike-warfare-but-is-that-a-good-idea/

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  November 7, 2018 | International, C4ISR

  Bringing Photonic Signaling to Digital Microelectronics

  DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01