GA-ASI Selected by DARPA to Support Liberty Lifter Program

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  22 juin 2018 | International, Naval, Terrestre

  BAE wins Marine Corps contract to build new amphibious combat vehicle

  By: Jen Judson WASHINGTON — BAE Systems has won a contract to build the Marine Corps' new amphibious combat vehicle following a competitive evaluation period where BAE's vehicle was pitted against an offering from SAIC. The contract allows for the company to enter into low-rate initial production with 30 vehicles expected to be delivered by fall of 2019, valued at $198 million. The Marines plan to field 204 of the vehicles. The total value of the contract with all options exercised is expected to amount to about $1.2 billion. The awarding of the contract gets the Corps “one step closer to delivering this capability to the Marines,” John Garner, Program Executive Officer, Land Systems Marine Corps, said during a media round table held Tuesday. But the Corps isn't quite done refining its new ACV. The vehicle is expected to undergo incremental changes with added new requirements and modernization. The Corps is already working on the requirements for ACV 1.2, which will include a lethality upgrade for the amphibous vehicle. BAE's ACV vehicle will eventually replace the Corps' legacy amphibious vehicle, but through a phased approach. The Assault Amphibious Vehicle is currently undergoing survivability upgrades to keep the Cold War era vehicle ticking into 2035. BAE Systems and SAIC were both awarded roughly $100 million each in November 2015 to deliver 16 prototypes to the Marine Corps for evaluation in anticipation of a down select to one vendor in 2018. [BAE, SAIC Named as Finalists in Marines ACV Competition] All government testing of the prototypes concluded the first week of December 2017 and the Marine Corps issued its request for proposals the first week in January 2018. Operational tests also began concurrently. Government testing included land reliability testing, survivability and blast testing and water testing — both ship launch and recovery as well as surf transit. Operational evaluations included seven prototypes each from both SAIC and BAE Systems, six participated and one spare was kept for backup. BAE Systems' partnered with Italian company Iveco Defense Vehicles to build its ACV offering. [BAE Systems completes Amphibious Combat Vehicle shipboard testing] Some of the features BAE believed were particularly attractive for a new ACV is that it has space for 13 embarked Marines and a crew of three, which keeps the rifle squad together. The engine's strength is 690 horsepower over the old engine's 560 horsepower, and it runs extremely quietly. The vehicle has a V-shaped hull to protect against underbody blasts, and the seat structure is completely suspended. SAIC's vehicle, which was built in Charleston, South Carolina, offered improved traction through a central tire-inflation system to automatically increase or decrease tire pressure. It also had a V-hull certified during tests at the Nevada Automotive Test Center — where all prototypes were tested by the Marine Corps — and had blast-mitigating seats to protect occupants. The 3rd Assault Amphibian Battalion, 1st Marine Division out of Camp Pendleton, California, is expected to receive the first ACV 1.1 vehicles. Marine Corps Times reporter Shawn Snow contributed to this report. https://www.defensenews.com/land/2018/06/19/bae-wins-marine-corps-contract-to-build-new-amphibious-combat-vehicle/

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  7 novembre 2018 | International, C4ISR

  Bringing Photonic Signaling to Digital Microelectronics

  DARPA program seeks to unleash the performance of modern multi-chip modules by integrating optical signaling at the chip-level OUTREACH@DARPA.MIL 11/1/2018 Parallelism – or the act of several processors simultaneously executing on an application or computation – has been increasingly embraced by the microelectronics industry as a way of sustaining demand for increased system performance. Today, parallel computing architectures have become pervasive across all application domains and system scales – from multicore processing units in consumer devices to high-performance computing in DoD systems. However, the performance gains from parallelism are increasingly constrained not by the computational limits of individual nodes, but rather by the movement of data between them. When residing on modern multi-chip modules (MCMs), these nodes rely on electrical links for short-reach connectivity, but once systems scale to the circuit board level and beyond, the performance of electrical links rapidly degrades, requiring large amounts of energy to move data between integrated circuits. Expanding the use of optical rather than electrical components for data transfer could help significantly reduce energy consumption while increasing data capacity, enabling the advancement of massive parallelism. “Today, microelectronic systems are severely constrained by the high cost of data movement, whether measured in terms of energy, footprint, or latency,” said Dr. Gordon Keeler, program manager in DARPA's Microsystems Technology Office (MTO). “Efficient photonic signaling offers a path to disruptive system scalability because it eliminates the need to keep data local, and it promises to impact data-intensive applications, including machine learning, large scale emulation, and advanced sensors.” Photonic transceiver modules already enable optical signaling over long distances with high bandwidth and minimal loss using optical fiber. Bottlenecks result, however, when data moves between optical transceivers and advanced integrated circuits in the electrical domain, which significantly limits performance. Integrating photonic solutions into the microelectronics package would remove this limitation and enable new levels of parallel computing. A new DARPA program, the Photonics in the Package for Extreme Scalability (PIPES) program, seeks to enable future system scalability by developing high-bandwidth optical signaling technologies for digital microelectronics. Working across three technical areas, PIPES aims to develop and embed integrated optical transceiver capabilities into cutting-edge MCMs and create advanced optical packaging and switching technologies to address the data movement demands of highly parallel systems. The efficient, high-bandwidth, package-level photonic signaling developed through PIPES will be important to a number of emerging applications for both the commercial and defense sectors. The first technical area of the PIPES program is focused on the development of high-performance optical input/output (I/O) technologies packaged with advanced integrated circuits (ICs), including field programmable gate arrays (FPGAs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs). Beyond technology development, the program seeks to facilitate a domestic ecosystem to support wider deployment of resulting technologies and broaden their impact. Projections of historic scaling trends predict the need for enormous improvements in bandwidth density and energy consumption to accommodate future microelectronics I/O. To help address this challenge, the second technical area will investigate novel component technologies and advanced link concepts for disruptive approaches to highly scalable, in-package optical I/O for unprecedented throughput. The successful development of package-level photonic I/O from PIPES' first two technical areas will create new challenges for systems architects. The development of massively interconnected networks with distributed parallelism will create hundreds to thousands of nodes that will be exceedingly difficult to manage. To help address this complexity, the third technical area of the PIPES program will focus on the creation of low-loss optical packaging approaches to enable high channel density and port counts, as well as reconfigurable, low-power optical switching technologies. A full description of the program is available in the Broad Agency Announcement. For more information, please visit: https://www.fbo.gov/spg/ODA/DARPA/CMO/HR001119S0004/listing.html https://www.darpa.mil/news-events/2018-11-01

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  28 septembre 2018 | International, Naval, Terrestre

  Is this the Marine Corps' next amphibious combat vehicle?

  By: Todd South MARINE CORPS BASE QUANTICO, Va. ― The winner of a contract to develop the Marine Corps new amphibious combat vehicle, the first of its kind in four decades, showcased a potential variant that would give commanders eyes on all areas of the littoral battlefield, on-board drones and targeted hand offs to any ACV in their formations. BAE Systems guided reporters through the interior of the vehicle, on display at this year's Modern Day Marine Expo in Quantico, Virginia, on Tuesday. The variant isn't one that the Marines have yet requested, but John Swift, program director for BAE's amphibious vehicles, said the model was an effort to showcase what's possible with the new vehicle. Marines selected the BAE version earlier this year over SAIC's proposed vehicle. Swift noted that decision keeps BAE as the sole company providing such vehicles to the Corps since 1941. They've got to build 30 vehicles by the end of next summer, Swift said. Those vehicles will then go through testing before modifications and the composition of the fleet is decided. Marines want at least two variants as production begins in the next two years: a turreted assault vehicle and a command and control vehicle. As of now, the Corps' official numbers call for 704 ACVs for the fleet when full rate production begins in 2022. That number is planned to be completed within six years, Swift said. The composition of the fleet is still undecided, so the initial 30 vehicles delivered for testing will be basic platforms. But that was before an announcement reported by Defense News this week that the survivability upgrade contract for the existing AAV fleet of an estimated 392 AAVs was cancelled. The move is in line with larger National Defense Strategy aims to ramp up modernization by prioritizing money for those programs rather than legacy platforms. Marine Corps Program Executive Office for Land Systems spokesman Manny Pacheco told reporters at this week's expo that the early version, or ACV 1.1 outperformed expectations and delivery of the new vehicles would not take much longer than the planned upgrades, which could shorten the calendar. The deliveries were about six months apart, he said. Meaning that the brand-new vehicles would arrives shortly after the upgraded vehicles were planned. Swift and Pacheco said separately that the ACV 1.1 was able to both launch and recover, meaning return to ship. That wasn't an expectation until later versions, which sped up the capability development of the new vehicle, giving the Marines other options in how they would pursue modernizing the fleet. In a question and answer posting about the ACV by the Marine Corps Combat Development Command, officials at the time said they would continue the upgrade program even if the early ACV versions achieved a “self-deployable capability.” The posting noted that the upgraded AAVs will “address capability gaps that need to be closed as soon as possible.” It went on to say that the aged AAV fleet also accounts for one-third of the Corps' lift capacity and “will need to remain operationally effective in the force until their replacements are procured.” Later in production there's also interest in building a recovery ACV, Swift said.https://www.marinecorpstimes.com/news/your-marine-corps/2018/09/27/is-this-the-marine-corps-next-amphibious-combat-vehicle The new ACV has a host of differences and capabilities not on the more than 40-year-old AAVs but most immediately noticeable is it is an eight-wheeled vehicle. Gone are the treads of the tracked AAV. When asked about tire performance by reporters, Swift said that in testing the ACV was able to travel another 30 km with three debilitated tires. The same questions and answers list had several reasons for wheels over tracks: Greater mobility in complex, littoral terrain; • Increased IED protection (2X). • Reduced fuel consumption (